A revolutionary advancement in thermal management technology has been accomplished by researchers at KAIST’s Department of Mechanical Engineering. This could crucially enhance the dependability and lifespan of contemporary semiconductor devices.
A major stride in thermal regulation of semiconductors has been achieved by engineers, who have discovered an innovative mode of heat transfer using surface plasmon polaritons (SPP). This ground-breaking approach boosts heat dispersal by 25% and could play a critical role in managing heat-related issues in downsized semiconductor devices.
The compulsion to reduce semiconductor size and the problem of insufficient heat dispersion at device hot spots have adversely impacted the trustworthiness and durability of current devices. Current thermal management solutions have not met the mark. Therefore, the uncovering of a new method of dispersing heat using surface waves produced on thin metal films over the substrate is a significant development.
KAIST, led by President Kwang Hyung Lee, announced that Professor Bong Jae Lee’s team from the Department of Mechanical Engineering has successfully measured a novel mode of heat transfer, termed ‘surface plasmon polariton’ (SPP), on a thin metal film placed on a substrate — a world first.
Schematic presentation of the principle of gauging the thermal conductivity of thin Titanium (TI) films and the thermal conductivity of surface plasmon polariton recorded on the Ti film. Credit: KAIST Center for Extreme Thermal Physics and Manufacturing.
Surface plasmon polariton (SPP) is a surface wave that occurs on a metal surface due to intense interaction between the electromagnetic field at the dielectric-metal interface and the free electrons and analogous co-vibrating particles on the metal surface.
The research group employed surface plasmon polaritons (SPP), which are surface waves produced at the metal-dielectric interface, to boost thermal diffusion in nanoscale thin metal films. Since this novel heat transfer mode comes into effect when a thin metal film is placed on a substrate, it can be conveniently incorporated into the device manufacturing process and has the advantage of scale. The research team demonstrated a thermal conductivity increase of roughly 25% due to surface waves generated over a 100-nm-thick titanium (Ti) film with a radius of approximately 3 cm.
Professor Bong Jae Lee, who headed the research, stated, “The import of this study is that we have identified a new heat transfer mode using surface waves over a thin metal film deposited on a substrate with low processing difficulty for the first time globally. This can be employed as a nanoscale heat spreader to efficiently disperse heat near hot spots in semiconductor devices prone to overheating.”
The finding has significant implications for developing high-performance semiconductor devices in the future as it can be used to rapidly dissipate heat on a nanoscale thin film. Notably, this new heat transfer mode identified by the research team is projected to address the core issue of thermal management in semiconductor devices as it allows even more efficient heat transfer at nanoscale thickness, while the thermal conductivity of the thin film usually decreases due to the boundary scattering effect.
This study was published online on April 26 in Physical Review Letters and was selected as an Editors’ Suggestion.
Reference: “Boosting Thermal Conductivity by Surface Plasmon Polaritons Propagating along a Thin Ti Film” by Dong-min Kim, Sinwoo Choi, Jungwan Cho, Mikyung Lim, and Bong Jae Lee, 26 April 2023, Physical Review Letters. DOI: 10.1103/PhysRevLett.130.176302
The study was conducted with support from the Basic Research Laboratory Support Program of the National Research Foundation of Korea.
Table of Contents
Frequently Asked Questions (FAQs) about thermal management
What is the significance of the breakthrough in thermal management technology for semiconductors?
The breakthrough in thermal management technology using surface plasmon polaritons (SPP) is significant because it can improve the reliability and longevity of modern semiconductor devices. It addresses overheating issues in miniaturized semiconductor devices, which have been a challenge due to the demand for smaller sizes and ineffective heat dispersion.
How does the use of surface plasmon polaritons (SPP) enhance heat dispersal in semiconductors?
Surface plasmon polaritons (SPP) are surface waves generated at the metal-dielectric interface. By utilizing SPP, thermal diffusion in nanoscale thin metal films is improved. When a thin film of metal is deposited on a substrate, this new heat transfer mode occurs, resulting in enhanced heat dispersal. The thermal conductivity of the thin film increases by approximately 25% due to the surface waves generated.
What are the advantages of using surface plasmon polaritons (SPP) for heat transfer in semiconductors?
Using surface plasmon polaritons (SPP) for heat transfer offers several advantages. Firstly, it can be easily incorporated into the device manufacturing process as the thin metal film can be deposited on the substrate. Secondly, it allows for heat dispersal over a large area, making it highly usable for semiconductor devices. Lastly, it provides more effective heat transfer at nanoscale thickness, even when the thermal conductivity of the thin film would typically decrease.
How does the breakthrough in thermal management technology benefit high-performance semiconductor devices?
The breakthrough in thermal management technology has significant implications for the development of high-performance semiconductor devices. It enables rapid heat dissipation on nanoscale thin films, which is crucial for preventing overheating in advanced devices. By efficiently dispersing heat near the hot spots, it enhances the overall performance, reliability, and durability of high-performance semiconductor devices.
Where was the research conducted, and where can I find more information?
The research was conducted by a team at KAIST’s Department of Mechanical Engineering. More information about the study can be found in the publication titled “Boosting Thermal Conductivity by Surface Plasmon Polaritons Propagating along a Thin Ti Film” in Physical Review Letters (DOI: 10.1103/PhysRevLett.130.176302).
More about thermal management
- KAIST Department of Mechanical Engineering: Website
- Physical Review Letters: Publication
- “Boosting Thermal Conductivity by Surface Plasmon Polaritons Propagating along a Thin Ti Film”: Research Paper
3 comments
Finally, a promising solution to the overheating problem in semiconductors. With the demand for smaller devices, effective thermal management is crucial. Surface plasmon polaritons seem like a fascinating technology to tackle this issue head-on.
kudos to the KAIST research team for their work on thermal management. this breakthrough could help solve the overheating issues we often see in small semiconductor devices. can’t wait to see it in action!
The description is concise and informative. It effectively captures the essence of the text, highlighting the use of surface plasmon polaritons for enhanced heat transfer. Great job!